Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12083715 | Mold compound dispensing system and method | Junrong Yan, C K Chin, Tao Shi | 2024-09-10 |
| 11894343 | Vertical semiconductor device with side grooves | Junrong Yan, Wei Liu, Zhonghua Qian | 2024-02-06 |