Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12083715 | Mold compound dispensing system and method | Xianlu Cui, C K Chin, Tao Shi | 2024-09-10 |
| 11901327 | Wire bonding for semiconductor devices | Yang Lei, Xiaofeng Di, Yuyun Lou, Zhonghua Qian | 2024-02-13 |
| 11894343 | Vertical semiconductor device with side grooves | Xianlu Cui, Wei Liu, Zhonghua Qian | 2024-02-06 |