Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057381 | Circuit board having laminated build-up layers | Chih-Chiang Lu, Hsin-Ning Liu, Jun-Rui Huang, Pei-Wei Wang, Ching-Sheng Chen | 2024-08-06 |
| 12052815 | Manufacturing method of circuit board | Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching-Shiang Chang, Ming-Ting Chang +3 more | 2024-07-30 |
| 11910535 | Printed circuit board stack structure and manufacturing method thereof | Ming-Hao Wu | 2024-02-20 |
| 11895773 | Circuit board structure | — | 2024-02-06 |
| 11859302 | Electroplating apparatus and electroplating method | Heng-Ming Nien, Chih-Chiang Lu, Chih-Kai Chan | 2024-01-02 |