Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156325 | Package carrier with improved heat dissipation efficiency and manufacturing method thereof | Hsuan-Wei Chen, Chi-Chun Po | 2024-11-26 |
| 12144113 | Circuit board structure | Chih-Chiang Lu, Chi-Min Chang, Yi-Pin Lin, Tung-Chang Lin, Jun-Rui Huang | 2024-11-12 |
| 12099522 | Method and system for reducing storage overhead of blockchain nodes, and storage medium | Guang Yang, Chenxing Li, Fengyu Zhang, Fan Long, Peilun Li | 2024-09-24 |
| 12016133 | Circuit board with a conductive bump mounted on an adhesive layer | Hsuan-Wei Chen | 2024-06-18 |
| 11910535 | Printed circuit board stack structure and manufacturing method thereof | Shih-Lian Cheng | 2024-02-20 |