Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156325 | Package carrier with improved heat dissipation efficiency and manufacturing method thereof | Ming-Hao Wu, Chi-Chun Po | 2024-11-26 |
| 12016133 | Circuit board with a conductive bump mounted on an adhesive layer | Ming-Hao Wu | 2024-06-18 |