Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057381 | Circuit board having laminated build-up layers | Chih-Chiang Lu, Jun-Rui Huang, Pei-Wei Wang, Ching-Sheng Chen, Shih-Lian Cheng | 2024-08-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057381 | Circuit board having laminated build-up layers | Chih-Chiang Lu, Jun-Rui Huang, Pei-Wei Wang, Ching-Sheng Chen, Shih-Lian Cheng | 2024-08-06 |