Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12151335 | Monitoring method for chemical mechanical polishing and chemical mechanical polishing device | Tongqing Wang, Hui Ci, Qingbo Liang, Haiyang Xu, Rui Tan | 2024-11-26 |
| 12109664 | Method for determining thickness of metal film of wafer, polishing device, and medium | Yingming WU, Fangxin Tian, Jie Liu | 2024-10-08 |