Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12109664 | Method for determining thickness of metal film of wafer, polishing device, and medium | Xinchun Lu, Yingming WU, Jie Liu | 2024-10-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12109664 | Method for determining thickness of metal film of wafer, polishing device, and medium | Xinchun Lu, Yingming WU, Jie Liu | 2024-10-08 |