Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176255 | Cantilevered dies in ceramic packages | Paul Merle Emerson, Mohammad Hadi Motieian Najar | 2024-12-24 |
| 11915986 | Ceramic semiconductor device package with copper tungsten conductive layers | Hector Torres | 2024-02-27 |