Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176255 | Cantilevered dies in ceramic packages | Ramlah Binte Abdul Razak, Paul Merle Emerson | 2024-12-24 |
| 12128444 | Broadband ultrasound transducers and related methods | Ali Kiaei, Baher Haroun | 2024-10-29 |