Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11915986 | Ceramic semiconductor device package with copper tungsten conductive layers | Ramlah Binte Abdul Razak | 2024-02-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11915986 | Ceramic semiconductor device package with copper tungsten conductive layers | Ramlah Binte Abdul Razak | 2024-02-27 |