Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961808 | Electronic package structure with reinforcement element | Wei Wang, Po-Jen Cheng, Fu-Yuan Chen | 2024-04-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961808 | Electronic package structure with reinforcement element | Wei Wang, Po-Jen Cheng, Fu-Yuan Chen | 2024-04-16 |