Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183683 | Electronic package structure | Wei Wang, Fu-Yuan Chen | 2024-12-31 |
| 11961808 | Electronic package structure with reinforcement element | Wei Wang, Fu-Yuan Chen, Yi-Hsin Cheng | 2024-04-16 |
| 11923285 | Electronic device package and method of manufacturing the same | Chien-Fan Chen | 2024-03-05 |