Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183683 | Electronic package structure | Wei Wang, Po-Jen Cheng | 2024-12-31 |
| 11961808 | Electronic package structure with reinforcement element | Wei Wang, Po-Jen Cheng, Yi-Hsin Cheng | 2024-04-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183683 | Electronic package structure | Wei Wang, Po-Jen Cheng | 2024-12-31 |
| 11961808 | Electronic package structure with reinforcement element | Wei Wang, Po-Jen Cheng, Yi-Hsin Cheng | 2024-04-16 |