Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125754 | Sensor package substrate, sensor module including the same, and electronic component embedded substrate | Kazutoshi TSUYUTANI, Akira MOTOHASHI | 2024-10-22 |
| 12077032 | Passage opening and closing device | Sei Ozaki, Fumitaka Yoshizumi, Takayuki Aoyama | 2024-09-03 |