Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125754 | Sensor package substrate, sensor module including the same, and electronic component embedded substrate | Yoshihiro Suzuki, Akira MOTOHASHI | 2024-10-22 |
KT
Kazutoshi TSUYUTANI
Overall (2024): #390,132 of 561,600Top 70%
1
Patents 2024