Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125754 | Sensor package substrate, sensor module including the same, and electronic component embedded substrate | Kazutoshi TSUYUTANI, Yoshihiro Suzuki | 2024-10-22 |
| 12059915 | Thermal transfer image receiving sheet | — | 2024-08-13 |
| 11972947 | Manufacturing method for semiconductor laminated film, and semiconductor laminated film | Yoshiyuki Suda, Takahiro Tsukamoto, Kyohei Degura, Katsumi Okubo, Takuma YAGI +3 more | 2024-04-30 |