Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062578 | Prevention of contact bottom void in semiconductor fabrication | Chung-Ting Ko, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang | 2024-08-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062578 | Prevention of contact bottom void in semiconductor fabrication | Chung-Ting Ko, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang | 2024-08-13 |