Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12161199 | Buffing system for footwear | Chun-Chieh Chen, Chia-Hung Lin, Hsien-Kuang Wu, Hung-Yu Wu | 2024-12-10 |
| 12062687 | Semiconductor device including a capacitor | Hong-Yang CHEN, Tian Sheng Lin, Yi-Cheng Chiu, Hung-Chou Lin, Kuo-Ming Wu +1 more | 2024-08-13 |
| 12029282 | Buffing system for footwear | Chun-Chieh Chen, Chia-Hung Lin, Hsien-Kuang Wu, Hung-Yu Wu | 2024-07-09 |
| 11942543 | Semiconductor device structure with high voltage device | Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Shiuan-Jeng Lin, Wen-Chih Chiang +4 more | 2024-03-26 |
| 11923425 | Shielding structure for ultra-high voltage semiconductor devices | Yi-Cheng Chiu, Tian Sheng Lin, Hung-Chou Lin, Chiu-Hua Chung | 2024-03-05 |
| 11862675 | High voltage metal-oxide-semiconductor (HVMOS) device integrated with a high voltage junction termination (HVJT) device | Karthick Murukesan, Wen-Chih Chiang, Chun Lin Tsai, Ker Hsiao Huo, Kuo-Ming Wu +5 more | 2024-01-02 |