Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183581 | Method of forming a semiconductor device by driving hydrogen into a dielectric layer from another dielectric layer | Hongfa Luan, Yi-Fan Chen, Chun-Yen Peng, Cheng-Po Chau, Huicheng Chang | 2024-12-31 |
| 12170208 | Method for managing temperature in semiconductor fabrication facility | Otto Chen, Ying-Yen Tseng, Chia-Chih Chen | 2024-12-17 |