HL

Hongfa Luan

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Baoshan, TX: #2 of 3 inventorsTop 70%
Overall (2024): #441,552 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12183581 Method of forming a semiconductor device by driving hydrogen into a dielectric layer from another dielectric layer Yi-Fan Chen, Chun-Yen Peng, Cheng-Po Chau, Wen-Yu Ku, Huicheng Chang 2024-12-31