Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955441 | Interconnect structure and forming method thereof | Jian-Hong Lin, Kuo-Yen Liu, Hsin Chang, Yu-Ching Lee, Yih Wang | 2024-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955441 | Interconnect structure and forming method thereof | Jian-Hong Lin, Kuo-Yen Liu, Hsin Chang, Yu-Ching Lee, Yih Wang | 2024-04-09 |