Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955441 | Interconnect structure and forming method thereof | Jian-Hong Lin, Hsin Chang, Tzu-Li Lee, Yu-Ching Lee, Yih Wang | 2024-04-09 |
KL
Kuo-Yen Liu
Overall (2024): #378,357 of 561,600Top 70%
1
Patents 2024