Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172263 | Chemical mechanical planarization tool | Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more | 2024-12-24 |
| 12131944 | Slurry composition, semiconductor structure and method for forming the same | Chun-Wei Hsu, Chih-Chieh Chang, Yi-Sheng Lin, Jian-Ci Lin, Jeng-Chi Lin +4 more | 2024-10-29 |
| 12002684 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2024-06-04 |