Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183550 | Wafer treatment system and method of treating wafer | Po-Hsun Chen, Chun-Wei Chou, Keng-Ying Liao, Tzu-Pin Lin, Tai-Chin Wu +1 more | 2024-12-31 |
| 12094997 | BSI chip with backside alignment mark | Chih-Wei Sung, Chung-Bin Tseng, Keng-Ying Liao, Yen-Jou Wu, Po-Zen Chen +1 more | 2024-09-17 |
| 12041771 | Polysilicon removal in word line contact region of memory devices | Yen-Jou Wu, Chih-Ming Lee, Keng-Ying Liao, Ping-Pang Hsieh, Hsin-Hui Lin +1 more | 2024-07-16 |
| 11899368 | Manufacturing method of semiconductor device and semiconductor processing system | Yu-Kai Chen, Chia-Hung Chung, Ko-Bin Kao, Li-Jen Wu, Zhi-You Ke +1 more | 2024-02-13 |