Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183550 | Wafer treatment system and method of treating wafer | Po-Hsun Chen, Chun-Wei Chou, Tzu-Pin Lin, Tai-Chin Wu, Su-Yu Yeh +1 more | 2024-12-31 |
| 12094997 | BSI chip with backside alignment mark | Chih-Wei Sung, Chung-Bin Tseng, Yen-Jou Wu, Po-Zen Chen, Su-Yu Yeh +1 more | 2024-09-17 |
| 12041771 | Polysilicon removal in word line contact region of memory devices | Yen-Jou Wu, Chih-Ming Lee, Ping-Pang Hsieh, Su-Yu Yeh, Hsin-Hui Lin +1 more | 2024-07-16 |
| 11901390 | Semiconductor device | Yu-Chien Ku, Huai-Jen Tung, Yi-Hung Chen, Shih-Hsun Hsu, Yi Yang | 2024-02-13 |
| 11903193 | Two dimensional structure to control flash operation and methods for forming the same | Chi-Chung Jen, Yu-Chu Lin, Y. C. Kuo, Wen-Chih Chiang, Huai-Jen Tung | 2024-02-13 |
| 11888074 | Flash memory device with three-dimensional half flash structure and methods for forming the same | Yu-Chu Lin, Chi-Chung Jen, Yi-Ling Liu, Wen-Chih Chiang, Huai-Jen Tung | 2024-01-30 |