Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183550 | Wafer treatment system and method of treating wafer | Po-Hsun Chen, Chun-Wei Chou, Keng-Ying Liao, Tzu-Pin Lin, Tai-Chin Wu +1 more | 2024-12-31 |
| 12094997 | BSI chip with backside alignment mark | Chih-Wei Sung, Chung-Bin Tseng, Keng-Ying Liao, Yen-Jou Wu, Su-Yu Yeh +1 more | 2024-09-17 |