Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183632 | Bottom lateral expansion of contact plugs through implantation | Meng-Han Chou, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2024-12-31 |
| 12112977 | Reducing spacing between conductive features through implantation | Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo, Meng-Han Chou | 2024-10-08 |
| 12068195 | Metal loss prevention using implantation | Li-Chieh Wu, Tang-Kuei Chang, Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang +5 more | 2024-08-20 |
| 12015055 | Doping for semiconductor device with conductive feature | Su-Hao Liu, Huicheng Chang, Chia-Cheng Chen, Liang-Yin Chen, Chun-Hung Wu +4 more | 2024-06-18 |
| 12009305 | Semiconductor device and method for forming the same | Chun-Hsien Huang, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2024-06-11 |
| 11984491 | Metal layer protection during wet etching | Su-Hao Liu, Huicheng Chang, Yee-Chia Yeo | 2024-05-14 |
| 11973027 | Semiconductor device and methods of forming the same | Pei-Yu Chou, Jr-Hung Li, Liang-Yin Chen, Su-Hao Liu, Tze-Liang Lee +4 more | 2024-04-30 |
| 11955553 | Source/drain structure | Su-Hao Liu, Wen-Yen Chen, Ying-Lang Wang, Liang-Yin Chen, Li-Ting Wang +1 more | 2024-04-09 |
| 11908740 | Semiconductor structure with doped via plug | Tung-Po Hsieh, Su-Hao Liu, Hong-Chih Liu, Jing-Huei Huang, Jie Huang +3 more | 2024-02-20 |
| 11901455 | Method of manufacturing a FinFET by implanting a dielectric with a dopant | Su-Hao Liu, Kai-Hsuan Lee, I-Hsieh Wong, Cheng-Yu Yang, Liang-Yin Chen +4 more | 2024-02-13 |
| 11862694 | Semiconductor device and method | Shih-Hsiang Chiu, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2024-01-02 |