Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183632 | Bottom lateral expansion of contact plugs through implantation | Su-Hao Liu, Kuo-Ju Chen, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2024-12-31 |
| 12112977 | Reducing spacing between conductive features through implantation | Kuo-Ju Chen, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2024-10-08 |
| 11973027 | Semiconductor device and methods of forming the same | Pei-Yu Chou, Jr-Hung Li, Liang-Yin Chen, Su-Hao Liu, Tze-Liang Lee +4 more | 2024-04-30 |
| 11901455 | Method of manufacturing a FinFET by implanting a dielectric with a dopant | Su-Hao Liu, Kuo-Ju Chen, Kai-Hsuan Lee, I-Hsieh Wong, Cheng-Yu Yang +4 more | 2024-02-13 |