Issued Patents 2024
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901396 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Dun-Nian Yaung, Wen-De Wang, Hsiao-Hui Tseng | 2024-02-13 |
| 11862535 | Through-substrate-via with reentrant profile | Hung-Ling Shih, Wei Chuang Wu, Shih Kuang Yang, Hsing-Chih Lin | 2024-01-02 |