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Chia-Han Lai

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Zhubeikou, TW: #100 of 193 inventorsTop 55%
Overall (2024): #510,788 of 561,600Top 95%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11929314 Interconnect structures including a fin structure and a metal cap Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao +4 more 2024-03-12