CL

Chia-Chieh Lin

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 New Taipei, TW: #607 of 1,741 inventorsTop 35%
Overall (2024): #509,701 of 561,600Top 95%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11915977 Interconnect structure for stacked device Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more 2024-02-27