Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176336 | Method of picking up die and method of manufacturing semiconductor package using the same | Mi Jeong YANG, Jinsung Jung | 2024-12-24 |
| 12096461 | Method and apparatus for thermal management of user equipment in wireless communication | Yangsoo Kwon, Inhyoung Kim, Inyup Kang, Mingoo Kim | 2024-09-17 |
| 12040818 | Communication device for performing detection operation and demodulation operation on codeword and operating method thereof | — | 2024-07-16 |
| 11937188 | Transmission power control of sounding reference signals in wireless communication system and device | Inhyoung Kim | 2024-03-19 |