Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176336 | Method of picking up die and method of manufacturing semiconductor package using the same | Youngseok Jung, Jinsung Jung | 2024-12-24 |
| 11871470 | Method for processing exceptional case of establishing default bearer in mobile communication system and device therefor | Jae Wook Shin, Ae-Soon Park | 2024-01-09 |