Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176336 | Method of picking up die and method of manufacturing semiconductor package using the same | Mi Jeong YANG, Youngseok Jung | 2024-12-24 |
JJ
Jinsung Jung
Overall (2024): #416,277 of 561,600Top 75%
1
Patents 2024