Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154889 | Semiconductor package | Hyunsoo Chung, Myungkee Chung, Jinchan Ahn | 2024-11-26 |
| 12009328 | Semiconductor package and method of manufacturing the same | Hyunsoo Chung, Myungkee Chung | 2024-06-11 |