Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166013 | Semiconductor package, and a package on package type semiconductor package having the same | Hyunsoo Chung, Younglyong Kim | 2024-12-10 |
| 12154889 | Semiconductor package | Hyunsoo Chung, Taewon Yoo, Jinchan Ahn | 2024-11-26 |
| 12009328 | Semiconductor package and method of manufacturing the same | Hyunsoo Chung, Taewon Yoo | 2024-06-11 |