Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154889 | Semiconductor package | Hyunsoo Chung, Taewon Yoo, Myungkee Chung | 2024-11-26 |
| 11894242 | Semiconductor package and method of manufacturing semiconductor package | Taeyoung Kim, Seokhong Kwon, Wonyoung Kim | 2024-02-06 |
| 11869878 | Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire | Kyungseon Hwang, Wonyoung Kim | 2024-01-09 |