Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166000 | Semiconductor device including a lower chip including a peripheral circuit and first and second memory chips vertically stacked thereon and data storage system including the same | Hoonjoo Na, Jungseob SO, Sohye CHO, Sonkwan HWANG | 2024-12-10 |
| 12107109 | Semiconductor device including through via, semiconductor package, and method of fabricating the same | Yi Koan Hong | 2024-10-01 |
| 12046538 | Semiconductor device including through via structure | Sonkwan HWANG, Hoonjoo Na, Kwangjin Moon, Hyungjun Jeon | 2024-07-23 |
| 11955408 | Integrated circuit semiconductor device including through silicon via | Sohye CHO, Pilkyu Kang, Kwangjin Moon | 2024-04-09 |