Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046538 | Semiconductor device including through via structure | Sonkwan HWANG, Taeseong Kim, Hoonjoo Na, Hyungjun Jeon | 2024-07-23 |
| 11961788 | Semiconductor device including through-electrodes | Hyoukyung Cho, Hojin Lee | 2024-04-16 |
| 11955408 | Integrated circuit semiconductor device including through silicon via | Sohye CHO, Pilkyu Kang, Taeseong Kim | 2024-04-09 |
| 11908775 | Semiconductor device | Jaewon Hwang, Hojin Lee, Hyungjun Jeon | 2024-02-20 |
| 11887957 | Semiconductor device | Jubin Seo, Sujeong Park, Myungjoo Park | 2024-01-30 |
| 11887966 | Semiconductor packages | Jinnam Kim, Seokho Kim, Hoonjoo Na | 2024-01-30 |