Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107109 | Semiconductor device including through via, semiconductor package, and method of fabricating the same | Taeseong Kim | 2024-10-01 |
YH
Yi Koan Hong
Overall (2024): #210,280 of 561,600Top 40%
1
Patents 2024