Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021032 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Yanggyoo Jung, Jinhyun Kang, Sungeun Kim, Seungkwan Ryu | 2024-06-25 |
| 11935867 | Semiconductor package with memory stack structure connected to logic dies via an interposer | Yanggyoo Jung, Sungeun Kim, Hae-Jung Yu | 2024-03-19 |