Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021032 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Yanggyoo Jung, Sungeun Kim, Sangmin Yong, Seungkwan Ryu | 2024-06-25 |
JK
Jinhyun Kang
Overall (2024): #416,243 of 561,600Top 75%
1
Patents 2024