Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080676 | Semiconductor package including a molding layer | — | 2024-09-03 |
| 11935867 | Semiconductor package with memory stack structure connected to logic dies via an interposer | Yanggyoo Jung, Sungeun Kim, Sangmin Yong | 2024-03-19 |