Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168837 | Tin-silver plating solution and method for forming tin-silver solder bump by using same | Woon Young Lee, Sang-Hoon Jin, Yu Geun Jo, Dong Ryul Lee | 2024-12-17 |
| 12018126 | Polyimide copolymer, method for preparing the polyimide copolymer, photosensitive resin composition, photosensitive resin film, and optical device using the polyimide copolymer | Bethy Kim, Young Jee Song, Seongho Jeon | 2024-06-25 |