Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168837 | Tin-silver plating solution and method for forming tin-silver solder bump by using same | Min Hyung Lee, Woon Young Lee, Sang-Hoon Jin, Dong Ryul Lee | 2024-12-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168837 | Tin-silver plating solution and method for forming tin-silver solder bump by using same | Min Hyung Lee, Woon Young Lee, Sang-Hoon Jin, Dong Ryul Lee | 2024-12-17 |