Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168837 | Tin-silver plating solution and method for forming tin-silver solder bump by using same | Min Hyung Lee, Sang-Hoon Jin, Yu Geun Jo, Dong Ryul Lee | 2024-12-17 |
| 12121628 | Method of surface treatment of titanium implant material using chloride and pulse power and titanium implant produced by the same | Ho Jun Song, Yeong Joon Park, Hye-Won Lee, Moon Jin Hwang, Hyun Joo Moon | 2024-10-22 |