Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142564 | Backside power distribution network semiconductor package and method of manufacturing the same | Saehan Park, Jeonghyuk Yim, Ki Il Kim, Gil Hwan Son | 2024-11-12 |
| 12125788 | Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same | Saehan Park, Gil Hwan Son, Byounghak Hong, Kang-ill Seo | 2024-10-22 |
| 12014951 | Semi-damascene structure with dielectric hardmask layer | Euibok Lee, Taeyong Bae | 2024-06-18 |
| 11990409 | Semiconductor device with fine metal lines for BEOL structure and method of manufacturing the same | Taeyong Bae | 2024-05-21 |
| 11881455 | Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same | Saehan Park, Gil Hwan Son, Byounghak Hong, Kang-ill Seo | 2024-01-23 |