Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183738 | Cross-coupled gate design for stacked device with separated top-down gate | Seunghyun Song, Seungyoung Lee | 2024-12-31 |
| 12142564 | Backside power distribution network semiconductor package and method of manufacturing the same | Hoonseok Seo, Jeonghyuk Yim, Ki Il Kim, Gil Hwan Son | 2024-11-12 |
| 12144163 | Selective double diffusion break structures for multi-stack semiconductor device | Byounghak Hong, Seunghyun Song, Seungyoung Lee, Inchan Hwang | 2024-11-12 |
| 12131996 | Stacked device with backside power distribution network and method of manufacturing the same | Seungyoung Lee, Inchan Hwang | 2024-10-29 |
| 12125788 | Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same | Hoonseok Seo, Gil Hwan Son, Byounghak Hong, Kang-ill Seo | 2024-10-22 |
| 11881455 | Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same | Hoonseok Seo, Gil Hwan Son, Byounghak Hong, Kang-ill Seo | 2024-01-23 |