Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021027 | Integrated circuit device having parallel conductive lines with bulging end portion(s) and method of manufacturing the same | Wandon Kim | 2024-06-25 |
| 12014951 | Semi-damascene structure with dielectric hardmask layer | Hoonseok Seo, Taeyong Bae | 2024-06-18 |